US Patent Issued to Mitsubishi Electric on April 8 for "Semiconductor device having lead connecting a semiconductor chip to a frame and projection extending from frame and a method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,624, issued on April 8, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device having lead connecting a semiconductor chip to a frame and projection extending from frame and a method of manufacturing semiconductor device" was invented by Masaomi Miyazawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, a semiconductor device includes a semiconductor chip, a frame, a projection projecting from the frame, a lead in which a projection insertion portion into which the projection is to be inserted is formed, and which directly contacts the frame to electrically connect the semiconductor chip to ...