US Patent Issued to MITSUBISHI ELECTRIC on April 8 for "Multiwire electric discharge machine, multiwire electric discharge machining method, and semiconductor wafer manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,104, issued on April 8, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Multiwire electric discharge machine, multiwire electric discharge machining method, and semiconductor wafer manufacturing method" was invented by Atsushi Itokazu (Tokyo), Yoichi Otomo (Tokyo) and Tsubasa Yagi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multiwire electric discharge machine includes: a plurality of guide rollers; a machining power supply that applies a voltage between each of a plurality of cutting wire sections and a workpiece; a dummy workpiece including a contact surface curved in such a way as to be capable of coming into contact with a curved...