US Patent Issued to MITSUBISHI ELECTRIC on April 8 for "Method for manufacturing composite substrate, and composite substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,107, issued on April 8, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Method for manufacturing composite substrate, and composite substrate" was invented by Kunihiko Nishimura (Tokyo), Keisuke Nakamura (Tokyo), Masahiro Fujikawa (Tokyo), Shuichi Hiza (Tokyo), Tomohiro Shinagawa (Tokyo) and Eiji Yagyu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Removal of substrates in a composite substrate is facilitated, and flaking of the composite substrate in an unintended process is prevented. A method for manufacturing a composite substrate includes: forming a first bonding material in a first surface of a first substrate; forming, in the first...