US Patent Issued to Mitsubishi Electric on April 1 for "Semiconductor device and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,627, issued on April 1, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method for manufacturing the same" was invented by Shinji Sakai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a die pad having a conductive property; a semiconductor chip; a back surface electrode formed on a back surface of the semiconductor chip; an Ag bonding material containing 50 to 85% Ag and bonding the back surface electrode and the die pad; a terminal connected to the semiconductor chip; and sealing resin having an insulating property and covering the die pad, the semiconductor chip, the Ag bonding ma...