US Patent Issued to Mitsubishi Chemical on May 13 for "Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,376, issued on May 13, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor device" was invented by Tomohiro Kyotani (Tokyo), Eiji Dejima (Tokyo), Naoko Sumitani (Tokyo), Tomohiro Kato (Tokyo) and Takeshi Sawai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a silica particle having excellent polishing characteristics and storage stability. The present invention relates to a silica particle in which a proportion of sil...