ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,242, issued on Feb. 3, was assigned to Mitsubishi Chemical Corp. (Tokyo).
"Epoxy resin composition, cured product, and electrical or electronic component" was invented by Kazumasa Ota (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An epoxy resin composition (A), containing an epoxy resin having a structure represented by formula (1) described below and an epoxy resin having a structure represented by formula (2) described below and/or an epoxy resin having a structure represented by formula (3) described below. 89.0% to 99.9% by mass of the epoxy resin (1) and 0.1% to 11.0% by mass of the epoxy resin (2) and/or the epoxy resin (3) are containe...