US Patent Issued to MITSUBISHI CHEMICAL on Dec. 30 for "Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,549, issued on Dec. 30, was assigned to MITSUBISHI CHEMICAL Corp. (Tokyo).

"Resin composition for laser direct structuring, molded article, and, method for manufacturing plated molded article" was invented by Tatsuya Kikuchi (Hiratsuka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin composition for laser direct structuring on which a plating can be formed and demonstrating low loss tangent, a molded article, and, a method for manufacturing a plated molded article. The resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, and the polycarbonate resin containing ...