US Patent Issued to MITSUBISHI CHEMICAL on Dec. 30 for "Resin composition, method for manufacturing resin composition, molded object, multilayer structure, and packaging body" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,578, issued on Dec. 30, was assigned to MITSUBISHI CHEMICAL Corp. (Tokyo).

"Resin composition, method for manufacturing resin composition, molded object, multilayer structure, and packaging body" was invented by Ryohei Komuro (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition containing: a thermoplastic resin (A) that does not contain a polar group; a thermoplastic resin (B) that contains a polar group; an ethylene-vinyl alcohol copolymer (C) having an ethylene content of 20 to 60 mol %; acetic acid and/or a salt thereof (D); an aliphatic carboxylic acid (E) having 3 or more carbon atoms; and an aliphatic carboxylic acid metal...