ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,838, issued on April 15, was assigned to Mitsubishi Chemical Corp. (Tokyo).
"Sheet molding compound and fiber-reinforced composite material" was invented by Akira Ota (Tokyo), Masahiro Ichino (Tokyo) and Takuya Teranishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25deg C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy grou...