US Patent Issued to Mitsubishi Chemical on April 15 for "Agglomerated boron nitride powder, heat dissipation sheet, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,888, issued on April 15, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Agglomerated boron nitride powder, heat dissipation sheet, and semiconductor device" was invented by Masanori Yamazaki (Tokyo), Masaya Sugiyama (Tokyo), Naoyuki Komuro (Tokyo) and Hiromu Watanabe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An agglomerated boron nitride powder, including a tap density of 0.6 g/ml or more and less than 0.8 g/ml and an interparticle void volume of 0.5 ml/g or more. A heat dissipation sheet, including the agglomerated boron nitride powder. An agglomerated boron nitride powder that enables a heat dissipation sheet to have improved therm...