US Patent Issued to MICROTECNICA on Jan. 13 for "Thermal compensated pressure relief valve using shape memory materials for high temperature application" (Italian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,311, issued on Jan. 13, was assigned to MICROTECNICA S.R.L. (Turin, Italy).

"Thermal compensated pressure relief valve using shape memory materials for high temperature application" was invented by Andrea Mornacchi (Turin, Italy), Federico Rombola' (Drapia, Italy) and Matteo Cappo (Turin, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure relief valve, PRV, includes an inlet and an outlet defining a fluid flow path therebetween and a plunger. The plunger is moveable between a closed position and an open position, wherein, in the closed position, the plunger blocks the fluid flow path, and, in the open position, fluid may flow through th...