US Patent Issued to Microsoft Technology Licensing on Nov. 18 for "Systems and methods for isolating faults in die-to-die interconnects" (American, Canadian, Malaysian Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,401, issued on Nov. 18, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.).

"Systems and methods for isolating faults in die-to-die interconnects" was invented by Terrence Huat Hin Tan (Bayan Lepas, Malaysia), Charles Walter Boecker (Ames, Iowa), Ravi Shivnaraine (Pickering, Canada), Edwin Magtoto Gozun (Folsom, Calif.) and Sokratis Vamvakos (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for isolating faults in die-to-die interconnects are provided. A method includes providing a first transmission path, along a die-to-die interconnect, from a transmitter associated with a first die to an asynch...