US Patent Issued to Microsoft Technology Licensing on July 29 for "Printed circuit board mesh routing to reduce solder ball joint failure during reflow" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,226, issued on July 29, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.).

"Printed circuit board mesh routing to reduce solder ball joint failure during reflow" was invented by Benito Joseph Rodriguez (Redmond, Wash.), Shu-Ming Chang (Taoyuan, Taiwan), Dillip Kumar Dash (San Diego), Po Chun Yang (Taipei, Taiwan) and Juan-Yi Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid array...