US Patent Issued to Micron Technology on Sept. 9 for "Split via structure for semiconductor device packaging" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,811, issued on Sept. 9, was assigned to Micron Technology Inc. (Boise, Idaho).

"Split via structure for semiconductor device packaging" was invented by Hong Wan Ng (Singapore), Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore), Ling Pan (Singapore) and See Hiong Leow (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly including a substrate; a first split via including a first via land that is disposed on a surface of the substrate and that has a first footprint with a half-moon shape with a first radius of curvature, and a first via that passes through the substrate and that has a second radius of curvatu...