US Patent Issued to Micron Technology on Sept. 9 for "Methods of detecting process deviations during microelectronic device fabrication and associated tapes and components" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,771, issued on Sept. 9, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods of detecting process deviations during microelectronic device fabrication and associated tapes and components" was invented by Ankur Harish Shah (Singapore), Venkateswarlu Bhavanasi (Singapore), Wen How Sim (Singapore) and Harjashan Veer Singh (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of identifying damaged microelectronic devices are described. A method includes applying a detection material to an active surface of a wafer. The detection material includes an additive configured to yield a visible reaction to heat or infrared or ne...