US Patent Issued to Micron Technology on Sept. 30 for "Three dimensional semiconductor trace length matching and associated systems and methods" (Singaporean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,418, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Three dimensional semiconductor trace length matching and associated systems and methods" was invented by Chin Hui Chong (Singapore), Seng Kim Ye (Singapore), Kelvin Tan Aik Boo (Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices with three-dimensional trace matching features, and related systems and methods, are disclosed herein. In some embodiments, an exemplary semiconductor device includes at least one semiconductor die and a redistribution layer disposed over the at least one semiconductor die and extending a...