US Patent Issued to Micron Technology on Sept. 30 for "Surface mount device bonded to an inner layer of a multi-layer substrate" (Singaporean, American, Malaysian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,859, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Surface mount device bonded to an inner layer of a multi-layer substrate" was invented by Kelvin Tan Aik Boo (George Town, Malaysia), Chin Hui Chong (Braddell Hill, Singapore), Seng Kim Ye (Fernvale Close, Singapore), Hong Wan Ng (Singapore) and Hem P. Takiar (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a primary layer of a substrate. The apparatus includes a secondary layer of the substrate having a first open area that extends through the secondary layer to an inner layer of the substrate. The apparatus includes the inner laye...