US Patent Issued to Micron Technology on Sept. 30 for "Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,984, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices including stack structures having doped interfacial regions, and related systems and methods" was invented by Everett A. McTeer (Eagle, Idaho), Farrell M. Good (Meridian, Idaho), John M. Meldrim (Boise, Idaho), Jordan D. Greenlee (Boise, Idaho), Justin D. Shepherdson (Meridian, Idaho), Naiming Liu (Boise, Idaho) and Yifen Liu (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device comprises conductive structures and insulative structures vertically alternating with the conductive structures. At least one of the i...