US Patent Issued to Micron Technology on Sept. 30 for "Integrated bracket for enhanced heat dissipation" (Indian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,880, issued on Sept. 30, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated bracket for enhanced heat dissipation" was invented by Shiva Pahwa (Bangalore, India), Abhilash Ramamurthy Nag (Bangalore, India) and Suresh Reddy Yarragunta (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Example embodiments are directed to an input/output (IO) bracket that may be used in a solid-state drive (SSD), the IO bracket comprises a faceplate and at least one heat pipe coupled to the faceplate that extends horizontally from a surface of the faceplate. The at least one heat pipe is configured to be coupled to a controller of the SSD...