US Patent Issued to Micron Technology on Sept. 23 for "Semiconductor device assemblies and associated methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,590, issued on Sept. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies and associated methods" was invented by Bharat Bhushan (Taichung, Taiwan), Akshay N. Singh (Boise, Idaho) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly can include an assembly substrate having a top surface, a top semiconductor device having a bottom surface, and a plurality of intermediary semiconductor devices. Each of intermediary semiconductor device can be bonded to both the assembly substrate top surface and the top device bottom surface. Each intermediary semicondu...