US Patent Issued to Micron Technology on Sept. 23 for "Polymer coated semiconductor devices and hybrid bonding to form semiconductor assemblies" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,574, issued on Sept. 23, was assigned to Micron Technology Inc. (Boise, Idaho).

"Polymer coated semiconductor devices and hybrid bonding to form semiconductor assemblies" was invented by Wei Zhou (Boise, Idaho), Eiichi Nakano (Boise, Idaho) and Ying Ta Chiu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly including a first semiconductor device having a front side and a back side opposite of the front side, metal interconnects formed on the back side, and a polymer material deposited over the first semiconductor device to encapsulate the sidewalls, back side, and metal interconnects. The first semicond...