US Patent Issued to Micron Technology on Oct. 7 for "Repair techniques for coupled memory dies" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,832, issued on Oct. 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Repair techniques for coupled memory dies" was invented by James Brian Johnson (Boise, Idaho), Brent Keeth (Boise, Idaho), Kunal R. Parekh (Boise, Idaho), Eiichi Nakano (Boise, Idaho) and Amy Rae Griffin (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for repair techniques for coupled host and memory dies are described. For example, to distribute memory access circuitry among multiple semiconductor dies of a stack, a first die may include a set of one or more memory arrays and a first portion of circuitry configured to access the ...