US Patent Issued to Micron Technology on Oct. 7 for "Integrated assemblies having voltage sources coupled to shields and/or plate electrodes through capacitors" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,586, issued on Oct. 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies having voltage sources coupled to shields and/or plate electrodes through capacitors" was invented by Jiyun Li (Boise, Idaho) and Scott J. Derner (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having first conductive lines which extend along a first direction, and having second conductive lines over the first conductive lines and which extend along a second direction that crosses the first direction. Capacitors are over the second conductive lines. The second conductive lines are operativel...