ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,694, issued on Oct. 7, was assigned to Micron Technology Inc. (Boise, Idaho).
"Configurable memory die capacitance" was invented by Jingwei Cheng (Shanghai) and Cheng Zhang (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for configurable memory die capacitance are described. A memory device may include a capacitive component, which may include one or more capacitors and associated switching components. The capacitive component may be coupled with an input/output (I/O) pad and an associated input buffer, and the one or more capacitors of the capacitive component may be selectively couplable with the I/O pad via t...