US Patent Issued to Micron Technology on Oct. 7 for "Conductive adhesive assembly for semiconductor die attachment" (Singaporean, Indian Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,113, issued on Oct. 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Conductive adhesive assembly for semiconductor die attachment" was invented by Ramesh Nallavelli (Sangareddy, India), Nagavenkata Varaprasad Nune (Hyderabad, India), Yeow Chon Ong (Toa Payoh, Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various semiconductor device assemblies. In some implementations, an adhesive assembly configured for semiconductor die attachment includes one or more adhesive films capable of semiconductor die attachment, and one or more conductive elements embedded in the...