US Patent Issued to Micron Technology on Oct. 7 for "Assemblies having conductive interconnects which are laterally and vertically offset relative to one another" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,083, issued on Oct. 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Assemblies having conductive interconnects which are laterally and vertically offset relative to one another" was invented by Raju Ahmed (Boise, Idaho), Radhakrishna Kotti (Boise, Idaho), David A. Kewley (Boise, Idaho) and Dave Pratt (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a base which includes first circuitry. Memory decks are over the base. Each of the memory decks has a sense/access line coupled with the first circuitry. The memory decks and base are vertically spaced from one another by gaps...