US Patent Issued to Micron Technology on Oct. 28 for "Microelectronic devices comprising a boron-containing material, and related electronic systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,685, issued on Oct. 28, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices comprising a boron-containing material, and related electronic systems and methods" was invented by Xiao Li (Boise, Idaho) and Jordan D. Greenlee (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device comprises a stack structure, a contact structure, a liner material, and a boron-containing material. The stack structure comprises alternating conductive structures and dielectric structures. The contact structure extends through the stack structure. The liner material is between the stack structure and the contact stru...