US Patent Issued to Micron Technology on Oct. 28 for "Capacitors having vertical contacts extending through conductive tiers" (American, Italian Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,757, issued on Oct. 28, was assigned to Micron Technology Inc. (Boise, Idaho).

"Capacitors having vertical contacts extending through conductive tiers" was invented by Paolo Tessariol (Montebelluna, Italy) and Qiang Tang (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes conductive materials located in different levels of the apparatus, dielectric materials located in different levels of the apparatus, a first conductive contact, and a second conductive contact. One of the conductive materials is between two of the dielectric m...