US Patent Issued to Micron Technology on Oct. 21 for "Systems and methods for direct bonding in semiconductor die manufacturing" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,455, issued on Oct. 21, was assigned to Micron Technology Inc. (Boise, Idaho).

"Systems and methods for direct bonding in semiconductor die manufacturing" was invented by Bang-Ning Hsu (Taichung, Taiwan) and Kyle K. Kirby (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for bonding semiconductor dies, resulting semiconductor devices, and associated systems and methods are disclosed. In some embodiments, the method includes depositing a first material on the first semiconductor die. The first material has a first outer surface and a first chemical composition at the first outer surface. The method also includes depositing a secon...