US Patent Issued to Micron Technology on Oct. 21 for "Semiconductor device assemblies including multiple stacks of different semiconductor dies" (Idaho Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,463, issued on Oct. 21, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies including multiple stacks of different semiconductor dies" was invented by Blaine J. Thurgood (Nampa, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly comprises a package substrate, a first stack of semiconductor dies having a first set of planform dimensions disposed over a first location on the substrate, a second stack of semiconductor dies having a second set of planform dimensions different from the first set disposed over a second location on the substrate, and an encapsul...