US Patent Issued to Micron Technology on Oct. 21 for "Integrated assemblies and methods of forming integrated assemblies" (Italian Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,099, issued on Oct. 21, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by Giorgio Servalli (Fara Gera d'Adda, Italy) and Marcello Mariani (Milan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having first and second pillars of semiconductor material. The first pillar includes a first source/drain region, and the second pillar includes a second source/drain region. First and second bottom electrodes are coupled with the first and second source/drain regions, respectively. The first and second source/drain regions a...