US Patent Issued to Micron Technology on Oct. 14 for "Semiconductor devices having staggered conductive contacts, and associated systems and methods" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,443, issued on Oct. 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor devices having staggered conductive contacts, and associated systems and methods" was invented by Yukitoshi Hirose (Kanagawa, Japan) and Yushi Inoue (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices, such as memory devices, and associated systems and methods, are disclosed herein. A representative semiconductor device includes (i) a substrate having multiple conductive first contacts, (ii) a semiconductor die coupled to the substrate and having multiple conductive second contacts, and (iii) multiple wire bonds electricall...