US Patent Issued to Micron Technology on Oct. 14 for "Overlapping die stacks for NAND package architecture" (Singaporean, American Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,709, issued on Oct. 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Overlapping die stacks for NAND package architecture" was invented by Enyong Tai (Singapore), Hem P. Takiar (Fremont, Calif.), Li Wang (Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly includes a substrate, a first stack of semiconductor dies disposed directly over a first location on the substrate, and a second stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. A portion of the semico...