US Patent Issued to Micron Technology on Nov. 4 for "Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentration" (Idaho Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,462,852, issued on Nov. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentration" was invented by John D. Hopkins (Meridian, Idaho), Jordan D. Greenlee (Boise, Idaho) and Peng Xu (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a method of forming a conductive structure. A metal-containing conductive material is formed over a supporting substrate. A surface of the metal-containing conductive material is exposed to at least one radical form of hydrogen and to at least one oxida...