ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,140, issued on Nov. 4, was assigned to Micron Technology Inc. (Boise, Idaho).
"Flexible interposer for semiconductor dies" was invented by Hong Wan Ng (Singapore), Seng Kim Ye (Singapore), Kelvin Aik Boo Tan (Singapore), See Hiong Leow (Singapore) and Ling Pan (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a first semiconductor die, a second semiconductor die in a stacked arrangement with the first semiconductor die, and a flexible interposer disposed between the first semiconductor die and t...