US Patent Issued to Micron Technology on Nov. 4 for "Conductive interconnects and methods of forming conductive interconnects" (Idaho Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,129, issued on Nov. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Conductive interconnects and methods of forming conductive interconnects" was invented by Raju Ahmed (Boise, Idaho), Frank Speetjens (Boise, Idaho), Darin S. Miller (Boise, Idaho), Siva Naga Sandeep Chalamalasetty (Boise, Idaho), Dave Pratt (Meridian, Idaho), Yi Hu (Boise, Idaho), Yung-Ta Sung (Boise, Idaho), Aaron K. Belsher (Boise, Idaho) and Allen R. Gibson (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulativ...