US Patent Issued to Micron Technology on Nov. 25 for "Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,781, issued on Nov. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methods" was invented by Bong Woo Choi (Singapore), Venkateswarlu Bhavanasi (Singapore), Wen How Sim (Singapore) and Harjashan Veer Singh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate comprises a first surface, a solder resist layer disposed over at least a portion of the fi...