ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,216, issued on Nov. 18, was assigned to Micron Technology Inc. (Boise, Idaho).
"Wire bonding for stacked memory dies" was invented by See Hiong Leow (Singapore), Hong Wan Ng (Singapore), Seng Kim Ye (Singapore), Kelvin Aik Boo Tan (Singapore) and Ling Pan (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for wire bonding for stacked memory dies are described. A memory system may include a stack of memory dies. As the stack grows to include more and more memory dies, the length of the wires coupling the memory dies with the control circuit may increase. Bonding multiple wires using an adhesive may increase a gap ...