US Patent Issued to Micron Technology on Nov. 18 for "Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact" (Idaho, Texas Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,202, issued on Nov. 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact" was invented by Avishesh Dhakal (Meridian, Idaho) and Gary A. Monroe (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices with a conformal coating in contact with a ground plane at a bottom side of the semiconductor devices and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a first surface of a package substrate. The semiconductor...