US Patent Issued to Micron Technology on Nov. 18 for "Integrated assemblies and methods of forming integrated assemblies" (American, Italian Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,734, issued on Nov. 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods of forming integrated assemblies" was invented by David H. Wells (Boise, Idaho), Aaron R. Wilson (Boise, Idaho) and Paolo Tessariol (Arcore, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a first deck with first memory cells arranged in first tiers disposed one atop another, and having a second deck over the first deck and with second memory cells arranged in second tiers disposed one atop another. Cell-material-pillars pass through the first and second decks. The cell-material...