US Patent Issued to Micron Technology on Nov. 11 for "Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods" (Idaho Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,809, issued on Nov. 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods" was invented by Kyle K. Kirby (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices having interconnect structures with vertically offset bonding surfaces, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a semiconductor substrate at least partially covered by a first dielectric material having an upper surface, and an interconnect structure extending therefrom. The inte...