US Patent Issued to Micron Technology on Nov. 11 for "Repeater scheme for inter-die signals in multi-die package" (Texas Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,823, issued on Nov. 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Repeater scheme for inter-die signals in multi-die package" was invented by Vijayakrishna J. Vankayala (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods, and devices related to techniques for repeating inter-die signals within a multi-die package of a memory device are disclosed. The multi-die package includes a memory stack including a first memory die handling interfacing with a host for the package and at least one second memory die coupled to and configured to communicate with the first memory die via an inter-die connection. A technique i...