US Patent Issued to Micron Technology on Nov. 11 for "Microelectronic devices with tier stacks with varied tier thicknesses, and related methods and systems" (Idaho Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,295, issued on Nov. 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices with tier stacks with varied tier thicknesses, and related methods and systems" was invented by John D. Hopkins (Meridian, Idaho) and Nancy M. Lomeli (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic devices include a stack structure of vertically alternating insulative and conductive structures arranged in tiers. The insulative structures of a lower portion of the stack structure are thicker than the insulative structures of an upper portion. The conductive structures of the lower portion are as thick, or thicker, than ...