US Patent Issued to Micron Technology on May 6 for "Semiconductor assemblies with systems and methods for managing high die stack structures" (Singaporean Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,992, issued on May 6, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor assemblies with systems and methods for managing high die stack structures" was invented by Kelvin Tan Aik Boo (Singapore), Seng Kim Ye (Singapore), Chin Hui Chong (Singapore) and Hong Wan Ng (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a rigid flex circuit that has a first rigid region and a second rigid region that are electrically connected by a flexible portion. A first die is mounted to a first side of the first rigid region. A second die is mounted to a second side of the second rigid region. The first and se...