US Patent Issued to Micron Technology on May 27 for "Conductive buffer layers for semiconductor die assemblies and associated systems and methods" (Idaho Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,833, issued on May 27, was assigned to Micron Technology Inc. (Boise, Idaho).

"Conductive buffer layers for semiconductor die assemblies and associated systems and methods" was invented by Wei Zhou (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Conductive buffer layers for semiconductor die assemblies, and associated systems and methods are disclosed. In an embodiment, a semiconductor die assembly includes first and second semiconductor dies directly bonded to each other. The first semiconductor die includes a first copper pad and the second semiconductor die includes a second copper pad. The first and second copper pads form an interc...