US Patent Issued to Micron Technology on May 27 for "Build-up package for integrated circuit devices, and methods of making same" (Singaporean, American Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,769, issued on May 27, was assigned to Micron Technology Inc. (Boise, Idaho).

"Build-up package for integrated circuit devices, and methods of making same" was invented by Hong Wan Ng (Singapore), Choon Kuan Lee (Singapore), David J. Corisis (Nampa, Idaho) and Chin Hui Chong (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die. Another illustrative example includes an integra...