US Patent Issued to Micron Technology on May 20 for "Multi-height interconnect structures and associated systems and methods" (Idaho Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,348, issued on May 20, was assigned to Micron Technology Inc. (Boise, Idaho).

"Multi-height interconnect structures and associated systems and methods" was invented by Kyle K. Kirby (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for multi-height interconnect structures for a semiconductor device are provided herein. The multi-height interconnect structure generally includes a primary level semiconductor die having a primary conductive pillar and a secondary conductive pillar, where the primary conductive pillar has a greater height than the secondary conductive pillar. The semiconductor device may further include a ...