US Patent Issued to Micron Technology on May 13 for "Systems and methods for temperature sensor access in die stacks" (Texas Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,098, issued on May 13, was assigned to Micron Technology Inc. (Boise, Idaho).

"Systems and methods for temperature sensor access in die stacks" was invented by Gary L. Howe (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device may include a memory array including a plurality of memory cells and a die stack including at least a portion of the plurality of memory cells. The memory device may also include multiple temperature sensors each designed to output a temperature code corresponding to the temperature of a respective die of the die stack. One die of the die stack is then designed to output the temperature code correspondin...