ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,570, issued on May 13, was assigned to Micron Technology Inc. (Boise, Idaho).
"Grindable heat sink for multiple die packaging" was invented by Wei Zhou (Boise, Idaho), Bret K. Street (Meridian, Idaho) and Kyle K. Kirby (Eagle, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package can include a semiconductor die stack including a top die and one or more core dies below the top die. The semiconductor package can further include a metal heat sink plated on a top surface of the top die and have a plurality of side surfaces coplanar with corresponding ones of a plurality of sidewalls of the semiconductor die stack. A molding can su...