ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,351, issued on May 13, was assigned to Micron Technology Inc. (Boise, Idaho).
"Die disablement" was invented by Yang Lu (Boise, Idaho) and Kang-Yong Kim (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Described apparatuses and methods relate to selectively disabling a die that may be included in a multiple-die package without necessarily disabling all the remaining dies within the package. A nonvolatile circuit, such as one or more fuses, may be included within individual dies and/or otherwise incorporated within the package. The nonvolatile circuit maintains a value for the die that is indicative of the operability of the die. Die disa...